The BondaScope 3100 Bond Tester - Part of the BondaScope Ultrasonic Bond Testing Range
The BondaScope 3100 Composite Bond Tester is the latest in a full series of Affordable, Feature Rich, and High Performance Ultrasonic Bond Testers available from Advanced NDT Limited, the originators of the first Microprocessor Based, Impedance Plane Resonance Bond Tester.
The BondaScope 3100 Bond Tester is well suited to inspecting metallic, nonmetallic and combination metallic-nonmetallic structures for a variety of anomalous conditions. These include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fiber damage, core damage, bondline thickness variations and certain material properties. Inspectable configurations include adhesivly-bonded laminates, advanced fiber composites and honeycombs. Some typical applications include:
Advanced NDT Limited is proud to announce the release of the long awaited BondaScope 3100, Full Multi-Mode, Ultrasonic Bond Tester.
New, Industry Leading Features of the BondaScope 3100 include Bond Profile Mode, Split Screen, High Energy - Pulsed Pitch-Catch Mode, Unique Sweeping Mechanical Impedance Analysis Mode (SweepMI), Separate Phase and Amplitude Alarm Ability, Xor Digital Phosphor EL Display Mode, True User Adjustable Display Persistence and Much More.
Bond Profile is a time encoded (with positional encoding optional) scanning presentation whereby the Phase/Amplitude are plotted in Real Time presenting a historic trend pattern allowing the user to assess the pattern over time. People generally find trended information is far easier to comprehend and therefore have a much higher confidence level in the inspection. Advanced NDT Limited was first to offer this in the BondaScope 300, Miniature Pitch-Catch Bond Tester.
Applications include the inspection of metallic, non-metallic and combination metallic/non-metallic structures for a variety of anomalous conditions. These include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fibre damage, core damage, bondline thickness variations, and certain material properties. Inspectable configurations include adhesively-bonded laminates, advanced fibre composites and honeycomb to mention a few. Some typical applications include multi-layer laminates, graphite resin composites, boron fibre composites, Kevlar composites, glass fibre composites, composite-to-substrate, composite-to-composite, honeycomb structures, skin-to honeycomb, honeycomb-to honeycomb and many more.
The patented, Industry Leader of the time, BondaScope 2100 is still supported (who else says that today) and in use by major manufacturers in Aerospace today who claim it is STILL the most "Sensitive" unit available today. NDT Systems has of course have met and improved on its performance with the BondaScope 3100 seen on this page.
BondaScope 3100 - Specifications
Modes: Resonance (RF & Flying Dot); Pitch Catch (Tone Burst - Adjustable Frequency, Cycles and Amplitude) High Energy Pulsed Mode. Swept Frequency; Mechanical Impedance Analysis (MIA) Fixed and Swept Frequency... Industry First.
Display: 240x320 QVGA, 5.7" Diag High Bright EL
Probe Connector: Standard 11 Pin Fischer - Adapts to other available probes.
Frequency Range: 250 - 1.5MHz Probe and setup specific
Alarm: Box, Polar and up to 8 individual and individually sizable "Ring Gates" centered at stored Reference Dot locations in Impedance Plane operation. Positive or negative operation.
Storage: 100 Setups & 250 Screens w/ Real Time Date and Time Stamp. Full 32 character Alpha-Numeric File naming with 8 lines of 32 characters for user comment or instruction.
Master Supervisor Setup and Lockout: Supervisory mode allows individual instrument setups parameters to be totally locked, totally unlocked or allow the user to operate ONLY within the supervisory defined parameters. For instance, allow frequency change within 24-28KHz and Gain within 35-40dB and no change to alarm etc. Available to EVERY instrument setup parameter! Industry First
Inputs & Outputs: 0-5VDC - Alarm - Positive or Negative - Latched or Momentary, Phase, Amplitude, X and Y Dot Location - Rate continuous in Resonance and Mechanical Impedance, USB
Power: Single Li-Ion High Energy Battery Smart Cell. In Battery Microprocessor reports current charge and time to empty - Approx 8 Full Hours Operation
Conditioning Fast Charger provides extended battery life and charge condition calibration. 85-240VAC Auto Sensing
Dimensions: 9.25H x 5.5W x 2.9D - Weight - 5Lbs
Operating Temperature: -10° to 140°F
Accessories and Options Include:
Contact Us regarding Probe Fixtures and Custom Application Requirements.
Applications include: AL Laminates, Composites, Honeycomb and more
BondaScope 300 - Pitch-Catch - Hand Held Bond Testing Unit - as used by the MOD / RAF for composite inspection
BondaScope 350 - Pitch-Catch & Resonance - Dual Mode Lightweight Hand-Held Bond Testing Instrument
BondaScope 3100 - Pitch-Catch, Resonance & MIA - Tri Mode Comprehensive Bond Tester
Products and Specifications Subject to Change Without Notice. E & O.E.