BondaScope 3100 BondaScope 3100 - Tri Mode Bond Tester
The BondaScope 3100 Bond Tester - Part of the BondaScope Ultrasonic Bond Testing Range
BondaScope 3100 Hand-held Multi mode Composite Bond Tester Tri-Mode - Pitch-catch (P/C), Mechanical Impedance Analysis (MIA) and Resonance modes Display Modes: RF, Impedance Plane, Flying Dot, Sweep, Time-encoded profile Programmable user set-ups, Alarm Modes Automatic probe recognition & Probe Library Tone burst, high energy pulsed mode, swept frequency Introduction As the use of adhesively bonded joints and fittings has increased across many industries, the need for testing bond integrity has grown. Metal to metal bonded joints, sandwich constructions with various skin and core materials, bonded carbon fibre composite structures have all become important in manufacturing as well as in-service repair patches and adhesively bonded                    re- enforcements. The integrity of these bonds is critical to the quality of the final product. Conventional ultrasonic methods can be limited for these applications and so a variety of alternative methods have been developed to handle this range of material combinations. Portable Bond Testing The BondaScope 3100 is a hand-held, battery operated ultrasonic bond tester that uses 3 different testing modes to cover a range of applications. Operating typically between 20kHz-400kHz, the lower frequency, compared to conventional ultrasonic testing, enables deeper penetration through attenuating materials, across multiple glue lines and even sandwich cores to detect far-side defects. The different display modes are optimized for different applications with a variety of gates and alarms to easily identify a flaw. Multi mode Operation The most common Pitch-Catch (P/C) and Resonance modes are suited to laminates, bonded and sandwich structures. Pitch- catch is dry coupled, easy to use and works well on larger defects, >0.5”. Resonance modes requires couplant, but can identify smaller defects and even determine which layer the defect occurred in with multi-layered bonded structures. Mechanical Impedance Analysis (MIA) Mode is dry coupled and most suited to metal-to-metal bonding and stiffer skin to core constructions. It has less penetration but works well on irregular and curved surfaces and with the small tip can accurately position the location of the defect. 6 Inspection Methods When a probe is connected to the BondaScope 3100, the automatic recognition optimizes the settings for the probe type. There are 6 inspection methods available: Pitch-Catch RF: Transmits a short burst of acoustic energy to the part and measures the amplitude and phase change of the received signal directly. A disbond reduces sound attenuation into the part leading to a higher amplitude at the receiver. Pitch-Catch Pulsed: Transits a spike pulse of broadband acoustic energy into the part and measures the amplitude of the received signal. Pitch-Catch Swept: Transmits a short burst of acoustic energy to the part across a pre-defined frequency range. The system measures the amplitude and phase change of the received signal. MIA Fixed Frequency: Probe tip driven at fixed frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change. This is related to the stiffness of the bond. MIA Swept Frequency: Probe tip driven with a swept frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change. Resonance: Probe driven at the resonance frequency and the damping caused by contact with the part is analysed. Defects are identified by a change in the phase and amplitude of the probe resonance caused by a change in acoustic impedance of the part. Results can be displayed in different modes including live RF envelope or impedance plane display. The Impedance-plane display (flying dot or swept) is a polar coordinate system showing the phase shift and amplitude of the test area compared to a nulled out good bond. A time-encoded profile of phase and amplitude can also be used for rapid scanning. There is a range of probes available for each inspection method and the system is also compatible with probes from other manufacturers for added functionality. The BondaScope 3100 Composite Bond Tester is the latest in a full series of Affordable, Feature Rich, and High Performance Ultrasonic Bond Testers available from Advanced NDT Limited, the originators of the first Microprocessor Based, Impedance Plane Resonance Bond Tester. The BondaScope 3100 Bond Tester is well suited to inspecting metallic, non-metallic and combination metallic / non-metallic structures for a variety of anomalous conditions. These include measurable levels of unbonds, voids, de-laminations, inclusions, porosity, fiber damage, core damage, bond line thickness variations and certain material properties. Inspectable configurations include adhesively-bonded laminates, advanced fiber composites and honeycombs. Features Standard package includes instrument, Pelican Style Hard Carry Case, Manual, Battery and AC charger Resonance, Pitch-catch (P/C) and Mechanical Impedance Analysis (MIA) modes Auto-probe recognition and probe library RF Impedance plane display mode Time encoded bond profile display mode Reference display mode Alarm modes: Amplitude, Phase. Halo, square, ellipse ring gates High speed swept frequency Individually sizeable 'ring' gates with alarms Compatible with probes from other manufacturers for added functionality SplitScan and SplitView New, Industry Leading Features of the BondaScope 3100 include Bond Profile Mode, Split Screen, High Energy - Pulsed Pitch- Catch Mode, Unique Sweeping Mechanical Impedance Analysis Mode (SweepMI), Separate Phase and Amplitude Alarm Ability, Xor Digital Phosphor EL Display Mode, True User Adjustable Display Persistence and Much More. Bond Profile is a time encoded (with positional encoding optional) scanning presentation whereby the Phase/Amplitude are plotted in Real Time presenting a historic trend pattern allowing the user to assess the pattern over time. People generally find trended information is far easier to comprehend and therefore have a much higher confidence level in the inspection. Advanced NDT Limited was first to offer this in the BondaScope 300, Miniature Pitch-Catch Bond Tester. Applications include the inspection of metallic, non-metallic and combination metallic/non-metallic structures for a variety of anomalous conditions. These include integrity of composites and adhesively bonded structures, multi-layered laminates, glass fibre / carbon fibre composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings, measurable levels of unbonds, voids, delaminations, disbonds, skin to core flaws, far-side defects, impact damage, liquid ingress, inclusions, porosity, fibre damage, core damage, bond line thickness variations, and certain material properties. Inspectable configurations include adhesively-bonded laminates, advanced fibre composites and honeycomb to mention a few. Some typical applications include: Multi-layered laminates Skin to core flaws Glass fiber composites Carbon Fiber Composites Boron Fiber Composites Graphite Resin Composites Kevlar Composites Composite to Substrate Composite to Composite Skin to Honeycomb Honeycomb to Honeycomb Far-side defects Honeycomb and foam cores Impact damage Metal to metal bonding Adhesively bonded fittings Liquid Ingress Rub Strip and more
Screenshot Examples
Applications include: Laminates, Composites, Honeycomb and more
Probe Examples: MIA, Pitch-Catch & Resonance
BondaScope 2100 - The patented, Industry Leader of the time. The BondaScope 2100 is still supported (who else says that today) and is in use by major manufacturers in Aerospace today who claim it is STILL the most "Sensitive" unit available today. NDT Systems has met and improved on its performance since with the BondaScope 3100 seen on this page.
Circa 1977
BondaScope 3100 Brochure BondaScope 3100 Brochure Bond Tester Range Bond Tester Range
BondHub  -  Multimode Imaging Bond Tester.  The New BondHub imaging system interfaces with the outputs from a standard BondaScope 3100. The world’s first multi-mode imaging bond tester with fully automatic C-scan imaging capability for testing the integrity of composites and adhesively bonded structures. Image in Resonance, Pitch-Catch and MIA modes using our manual or automatic scanners. It acts as a motion controller for the x-y scanners and has dedicated imaging software preloaded for generation and analysis of C-Scan images. The BondHub is built into a robust Pelican style case for easy set-up and transportation, and even acts as storage for the BondaScope 3100, probes and cables. A truly great addition to the BondaScope 3100 Ultrasonic Bond Tester.
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BondaScope 3100 BondaScope 3100 - Tri Mode Bond Tester
The BondaScope 3100 Bond Tester - Part of the BondaScope Ultrasonic Bond Testing Range
BondaScope 3100 Hand-held Multi mode Composite Bond Tester Tri-Mode - Pitch-catch (P/C), Mechanical Impedance Analysis (MIA) and Resonance modes Display Modes: RF, Impedance Plane, Flying Dot, Sweep, Time- encoded profile Programmable user set-ups, Alarm Modes Automatic probe recognition & Probe Library Tone burst, high energy pulsed mode, swept frequency Introduction As the use of adhesively bonded joints and fittings has increased across many industries, the need for testing bond integrity has grown. Metal to metal bonded joints, sandwich constructions with various skin and core materials, bonded carbon fibre composite structures have all become important in manufacturing as well as in-service repair patches and adhesively bonded                    re-enforcements. The integrity of these bonds is critical to the quality of the final product. Conventional ultrasonic methods can be limited for these applications and so a variety of alternative methods have been developed to handle this range of material combinations. Portable Bond Testing The BondaScope 3100 is a hand-held, battery operated ultrasonic bond tester that uses 3 different testing modes to cover a range of applications. Operating typically between 20kHz-400kHz, the lower frequency, compared to conventional ultrasonic testing, enables deeper penetration through attenuating materials, across multiple glue lines and even sandwich cores to detect far-side defects. The different display modes are optimized for different applications with a variety of gates and alarms to easily identify a flaw. Multi mode Operation The most common Pitch-Catch (P/C) and Resonance modes are suited to laminates, bonded and sandwich structures. Pitch-catch is dry coupled, easy to use and works well on larger defects, >0.5”. Resonance modes requires couplant, but can identify smaller defects and even determine which layer the defect occurred in with multi-layered bonded structures. Mechanical Impedance Analysis (MIA) Mode is dry coupled and most suited to metal-to- metal bonding and stiffer skin to core constructions. It has less penetration but works well on irregular and curved surfaces and with the small tip can accurately position the location of the defect. 6 Inspection Methods When a probe is connected to the BondaScope 3100, the automatic recognition optimizes the settings for the probe type. There are 6 inspection methods available: Pitch-Catch RF: Transmits a short burst of acoustic energy to the part and measures the amplitude and phase change of the received signal directly. A disbond reduces sound attenuation into the part leading to a higher amplitude at the receiver. Pitch-Catch Pulsed: Transits a spike pulse of broadband acoustic energy into the part and measures the amplitude of the received signal. Pitch-Catch Swept: Transmits a short burst of acoustic energy to the part across a pre-defined frequency range. The system measures the amplitude and phase change of the received signal. MIA Fixed Frequency: Probe tip driven at fixed frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change. This is related to the stiffness of the bond. MIA Swept Frequency: Probe tip driven with a swept frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change. Resonance: Probe driven at the resonance frequency and the damping caused by contact with the part is analysed. Defects are identified by a change in the phase and amplitude of the probe resonance caused by a change in acoustic impedance of the part. Results can be displayed in different modes including live RF envelope or impedance plane display. The Impedance-plane display (flying dot or swept) is a polar coordinate system showing the phase shift and amplitude of the test area compared to a nulled out good bond. A time-encoded profile of phase and amplitude can also be used for rapid scanning. There is a range of probes available for each inspection method and the system is also compatible with probes from other manufacturers for added functionality. The BondaScope 3100 Composite Bond Tester is the latest in a full series of Affordable, Feature Rich, and High Performance Ultrasonic Bond Testers available from Advanced NDT Limited, the originators of the first Microprocessor Based, Impedance Plane Resonance Bond Tester. The BondaScope 3100 Bond Tester is well suited to inspecting metallic, non- metallic and combination metallic / non-metallic structures for a variety of anomalous conditions. These include measurable levels of unbonds, voids, de-laminations, inclusions, porosity, fiber damage, core damage, bond line thickness variations and certain material properties. Inspectable configurations include adhesively-bonded laminates, advanced fiber composites and honeycombs. Features Standard package includes instrument, Pelican Style Hard Carry Case, Manual, Battery and AC charger Resonance, Pitch-catch (P/C) and Mechanical Impedance Analysis (MIA) modes Auto-probe recognition and probe library RF Impedance plane display mode Time encoded bond profile display mode Reference display mode Alarm modes: Amplitude, Phase. Halo, square, ellipse ring gates High speed swept frequency Individually sizeable 'ring' gates with alarms Compatible with probes from other manufacturers for added functionality SplitScan and SplitView New, Industry Leading Features of the BondaScope 3100 include Bond Profile Mode, Split Screen, High Energy - Pulsed Pitch-Catch Mode, Unique Sweeping Mechanical Impedance Analysis Mode (SweepMI), Separate Phase and Amplitude Alarm Ability, Xor Digital Phosphor EL Display Mode, True User Adjustable Display Persistence and Much More. Bond Profile is a time encoded (with positional encoding optional) scanning presentation whereby the Phase/Amplitude are plotted in Real Time presenting a historic trend pattern allowing the user to assess the pattern over time. People generally find trended information is far easier to comprehend and therefore have a much higher confidence level in the inspection. Advanced NDT Limited was first to offer this in the BondaScope 300, Miniature Pitch-Catch Bond Tester. Applications include the inspection of metallic, non-metallic and combination metallic/non-metallic structures for a variety of anomalous conditions. These include integrity of composites and adhesively bonded structures, multi- layered laminates, glass fibre / carbon fibre composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings, measurable levels of unbonds, voids, delaminations, disbonds, skin to core flaws, far-side defects, impact damage, liquid ingress, inclusions, porosity, fibre damage, core damage, bond line thickness variations, and certain material properties. Inspectable configurations include adhesively-bonded laminates, advanced fibre composites and honeycomb to mention a few. Some typical applications include: Multi-layered laminates Skin to core flaws Glass fiber composites Carbon Fiber Composites Boron Fiber Composites Graphite Resin Composites Kevlar Composites Composite to Substrate Composite to Composite Skin to Honeycomb Honeycomb to Honeycomb Far-side defects Honeycomb and foam cores Impact damage Metal to metal bonding Adhesively bonded fittings Liquid Ingress Rub Strip and more
Probe Examples: MIA, Pitch-Catch & Resonance
BondaScope 2100 - The patented, Industry Leader of the time. The BondaScope 2100 is still supported (who else says that today) and is in use by major manufacturers in Aerospace today who claim it is STILL the most "Sensitive" unit available today. NDT Systems has met and improved on its performance since with the BondaScope 3100 seen on this page. Circa 1977
BondHub  -  Multimode Imaging Bond Tester.  The New BondHub imaging system interfaces with the outputs from a standard BondaScope 3100. The world’s first multi-mode imaging bond tester with fully automatic C-scan imaging capability for testing the integrity of composites and adhesively bonded structures. Image in Resonance, Pitch- Catch and MIA modes using our manual or automatic scanners. It acts as a motion controller for the x-y scanners and has dedicated imaging software preloaded for generation and analysis of C-Scan images. The BondHub is built into a robust Pelican style case for easy set-up and transportation, and even acts as storage for the BondaScope 3100, probes and cables. A truly great addition to the BondaScope 3100 Ultrasonic Bond Tester.
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