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Products and Specifications Subject to Change Without Notice.                                                                                                         E & O.E.
Advanced NDT Limited Orchard House - Orchard Close Severn Stoke - Worcester WR8 9JJ - UK Tel: 44 (0) 1905 371460 - Fax: 44 (0) 1905 371477 Email: sales@advanced-ndt.co.uk - Web: www.advanced-ndt.co.uk
BondHub BondHub - Multi Mode Imaging Bond Tester
The BondHub Multimode Imaging Bond Tester - Part of the BondaScope Bond Testing Range
BondHub - Multimode Imaging Bond Tester. Advanced NDT Ltd & NDT Systems Inc are proud to introduce one of the world’s first multi-mode imaging bond tester with fully automatic C-scan imaging capability for testing the integrity of composites and adhesively bonded structures. Image in Resonance, Pitch-Catch and MIA modes using any of our manual or automatic scanners. The BondHub Imaging Bond Tester utilizes the full capability of the well-established BondaScope 3100 and connects to our manual or automatic scanners to generate high-resolution C-Scan images in Pitch-Catch, MIA and Resonance modes. Inspection of composites and adhesively bonded materials has not seen such an advancement for many years. The power of full-field inspection images using bond testing elevates non-destructive inspection capability to a new level. Imaging Bond Testing offers many advantages including: Easy interpretation Increased probability of detection Digital Archiving of results Pitch-Catch and MIA Modes require no couplant More consistent and reliable results Reduced effect of human error on results Increased speed of inspection
Full-field C-Scan results on composites & bonded structures, 12” x 18” scan area
Applications Integrity of composites and adhesively bonded structures Multi-layered laminates, glass fibre / carbon fibre composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings Delaminations, disbonds, crushed core, skin to core flaws, far-side defects, impact damage, liquid ingress and more Features C-Scan Imaging using Resonance, Pitch-Catch and Mechanical Impedance Analysis (MIA) modes No couplant required for Pitch-Catch and MIA modes Image analysis, defect sizing, multiple gates, reporting Portable, battery operated system, large sun-readable screen Connects directly to a BondaScope 3100 and scanners Compatible with other manufacturer’s bond testers
Introduction As the use of composites and adhesively bonded joints has increased across many industries, the need for testing bond integrity has grown to improve the quality of the final product. Conventional ultrasonic methods can be limited for these applications and so a variety of alternative methods have been developed to handle this range of material combinations. Bond testing was once limited to manual point measurements, which offer no archiving, were open to user error, and often defects could be missed because of the small variation in signal that the defect represents. Imaging Device and Motion Controller The new BondHub imaging system interfaces with the outputs from a standard BondaScope 3100. It acts as the motion controller for the X-Y scanners and has dedicated imaging software preloaded for generation and analysis of C-Scan images. Featuring a large sun-readable screen, high-speed CPU and a large state storage, the BondHub is built into a robust Pelican style case for easy set-up and transportation, and even acts as storage for the BondaScope 3100, probes and cables. Full Battery Operation Meeting the demands of the job, the entire system, including scanners, is battery operated, making inspections possible in almost any location. A quick release keyboard and mouse are standard for practical operation. Advanced Image Analysis The CompVue software displays the live signal from the BondaScope 3100 in the well-known Phase and Amplitude Impedance plane. Once a scan is defined, the system automatically generates the C-Scan image in real time. Various alarms and gates can be used, including new colour gating for depth analysis in resonance mode. Phase, Amplitude, and a special Additive display can be displayed as variables. A host of analysis tools including defect sizing can be used before simple export via USB.
Screenshot examples
The Imaging Bond Tester takes composite inspection into the 21st century with the BondHub delivering the most significant advancement in years. *Requires BondaScope 3100, probes, probe cables and scanner.
Bond Tester Range Bond Tester Range
BondaScope 350 Dual Mode - Pitch-Catch & Resonance Bond Tester in a robust hand-held package.  
BondaScope 3100 Tri-Mode - Pitch-Catch, Resonance & MIA (Mechanical Impedance Analysis) Bond Tester in a Portable Unit.  
Quantum Curlin Air Non Contact Air Coupled Ultrasonic Flaw Detector & Bond Tester  
Other Bond Testing Equipment available from Advanced NDT Limited...
BondHub Brochure BondHub Brochure
StringScan II Simple Lightweight Manual X-Y scanner 30in. x 30in. (0.76m x 0.76m) scan area Suction Feet Liquid feed Versatile and portable 0.020in. (0.50mm) Resolution Works with: Raptor Imaging flaw detector BondHub Brochure available on this item, Please view for more information.
SlideScan Lightweight Manual X-Y Scanner Suction Feet Phased Array (PAUT) Ready Customized probe holders and encoder cables Three sizes available:- o SlideScan 18x18 - Scan area 18in. x 18in. (0.46m x 0.46m) o SlideScan 24x24 - Scan area 24in. x 24in. (0.61m x 0.61m) o SlideScan 36x36 - Scan area 36in. x 36in. (0.91m x 0.91m) Works with: Raptor Imaging flaw detector BondHub Compatible with Phased Array Systems from other                 manufacturers. Optional Probe Holders & Cables available                                              (manufacturer specific) Brochure available on this item, Please view for more information.
CrosScan - (Previously VS2M) Automatic X-Y Scanner 24in. x 24in. (0.61m x 0.61m) scan area Suction feet Liquid feed Battery operated or AC powered 0.020in. (0.5mm) Resolution Works with: Raptor Imaging flaw detector BondHub
TunnelScan Motorized portable X-Y Scan Bridge 18in. x 12in. (0.46m x 0.30m) scan area Suction feet Liquid feed Battery operated or AC powered Self-contained battery operated unit High Resolution = 0.001in. (0.025mm) Works with: Raptor Imaging flaw detector BondHub Brochure available on this item, Please view for more information.
Scanners The BondHub also supports a growing list of available scanners from simple manual scanners to automatic scanners. There are even lightweight battery powered (NO AC Power is required) scanners available providing controlled motion semi automated scanning capability. The battery powered scanners are powered via an external battery pack incorporating the same battery as used in the BondaScope 3100 instrument.
*Requires BondaScope 3100, probes, probe cables and scanner.
Pitch-Catch C-Scan
Resonance C-Scan
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Impedance plane Scatter plot showing all data points. Multiple gate options, re-positioning or origin, ‘dead zone’ creation, 2D modelling
MIA inspection of Space panel - a carbon skinned, aluminium honeycomb sample with crushed core, damaged core, disbonds and more.
Resonance inspection of 1/4” carbon laminate. Included brass foil, armalon, release ply, release foil, pressure sensitive tape inserts at different depths.
Resonance inspection of adhesive glue line - showing cracks and voids on the adhesive through the carbon skin.
Resonance inspection of carbon laminate step block with embedded defects. Approximate thickness 0.014” - 0.070”
MIA inspection of composite honeycomb reference standard.
Pitch-catch inspection on a section of aircraft spoiler - glass/carbon skin, phenolic honeycomb with skin-core disbonds.
BondHub BondHub - Multi Mode Imaging Bond Tester
The BondHub Multimode Imaging Bond Tester - Part of the BondaScope Bond Testing Range
BondHub - Multimode Imaging Bond Tester. Advanced NDT Ltd & NDT Systems Inc are proud to introduce one of the world’s first multi-mode imaging bond tester with fully automatic C-scan imaging capability for testing the integrity of composites and adhesively bonded structures. Image in Resonance, Pitch-Catch and MIA modes using any of our manual or automatic scanners. The BondHub Imaging Bond Tester utilizes the full capability of the well-established BondaScope 3100 and connects to our manual or automatic scanners to generate high-resolution C- Scan images in Pitch-Catch, MIA and Resonance modes. Inspection of composites and adhesively bonded materials has not seen such an advancement for many years. The power of full-field inspection images using bond testing elevates non-destructive inspection capability to a new level. Imaging Bond Testing offers many advantages including: Easy interpretation Increased probability of detection Digital Archiving of results Pitch-Catch and MIA Modes require no couplant More consistent and reliable results Reduced effect of human error on results Increased speed of inspection
Full-field C-Scan results on composites & bonded structures, 12” x 18” scan area
Applications Integrity of composites and adhesively bonded structures Multi-layered laminates, glass fibre / carbon fibre composites, honeycomb and foam cores, metal to metal bonding, adhesively bonded fittings Delaminations, disbonds, crushed core, skin to core flaws, far-side defects, impact damage, liquid ingress and more Features C-Scan Imaging using Resonance, Pitch-Catch and Mechanical Impedance Analysis (MIA) modes No couplant required for Pitch-Catch and MIA modes Image analysis, defect sizing, multiple gates, reporting Portable, battery operated system, large sun-readable screen Connects directly to a BondaScope 3100 and scanners Compatible with other manufacturer’s bond testers
Introduction As the use of composites and adhesively bonded joints has increased across many industries, the need for testing bond integrity has grown to improve the quality of the final product. Conventional ultrasonic methods can be limited for these applications and so a variety of alternative methods have been developed to handle this range of material combinations. Bond testing was once limited to manual point measurements, which offer no archiving, were open to user error, and often defects could be missed because of the small variation in signal that the defect represents. Imaging Device and Motion Controller The new BondHub imaging system interfaces with the outputs from a standard BondaScope 3100. It acts as the motion controller for the X-Y scanners and has dedicated imaging software preloaded for generation and analysis of C-Scan images. Featuring a large sun-readable screen, high- speed CPU and a large state storage, the BondHub is built into a robust Pelican style case for easy set-up and transportation, and even acts as storage for the BondaScope 3100, probes and cables. Full Battery Operation Meeting the demands of the job, the entire system, including scanners, is battery operated, making inspections possible in almost any location. A quick release keyboard and mouse are standard for practical operation. Advanced Image Analysis The CompVue software displays the live signal from the BondaScope 3100 in the well-known Phase and Amplitude Impedance plane. Once a scan is defined, the system automatically generates the C-Scan image in real time. Various alarms and gates can be used, including new colour gating for depth analysis in resonance mode. Phase, Amplitude, and a special Additive display can be displayed as variables. A host of analysis tools including defect sizing can be used before simple export via USB.
Screenshot examples
The Imaging Bond Tester takes composite inspection into the 21st century with the BondHub delivering the most significant advancement in years. *Requires BondaScope 3100, probes, probe cables and scanner.
Other Bond Testing Equipment available from Advanced NDT Limited...
Scanners The BondHub also supports a growing list of available scanners from simple manual scanners to automatic scanners. There are even lightweight battery powered (NO AC Power is required) scanners available providing controlled motion semi automated scanning capability. The battery powered scanners are powered via an external battery pack incorporating the same battery as used in the BondaScope 3100 instrument.
*Requires BondaScope 3100, probes, probe cables and scanner.
Pitch-Catch C-Scan
Resonance C-Scan
Impedance plane Scatter plot showing all data points. Multiple gate options, re-positioning or origin, ‘dead zone’ creation, 2D modelling
MIA inspection of Space panel - a carbon skinned, aluminium honeycomb sample with crushed core, damaged core, disbonds and more.
Resonance inspection of 1/4” carbon laminate. Included brass foil, armalon, release ply, release foil, pressure sensitive tape inserts at different depths.
Resonance inspection of adhesive glue line - showing cracks and voids on the adhesive through the carbon skin.
Resonance inspection of carbon laminate step block with embedded defects. Approximate thickness 0.014” - 0.070”
MIA inspection of composite honeycomb reference standard.
Pitch-catch inspection on a section of aircraft spoiler - glass/carbon skin, phenolic honeycomb with skin-core disbonds.
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StringScan II Simple Lightweight Manual X-Y scanner 30in. x 30in. (0.76m x 0.76m) scan area Suction Feet  Liquid feed Versatile and portable 0.020in. (0.50mm) Resolution Works with: Raptor Imaging flaw detector BondHub Brochure available on this item, Please view for more information.
TunnelScan Motorized portable X-Y Scan Bridge 18in. x 12in. (0.46m x 0.30m) scan area Suction feet or (optional) Magnetic feet Liquid feed Battery operated or AC powered Self-contained battery operated unit High Resolution = 0.001in. (0.025mm) Works with: Raptor Imaging flaw detector BondHub Brochure available on this item, Please view for more information.
SlideScan Lightweight Manual X-Y Scanner Suction Feet Phased Array (PAUT) Ready Customized probe holders and encoder cables Three sizes available:- o SlideScan 18x18 - Scan area 18in. x 18in. (0.46m x 0.46m) o SlideScan 24x24 - Scan area 24in. x 24in. (0.61m x 0.61m) o SlideScan 36x36 - Scan area 36in. x 36in. (0.91m x 0.91m) Works with: Raptor Imaging flaw detector BondHub Compatible with Phased Array Systems from other                 manufacturers.  Optional Probe Holders & Cables available                                              (manufacturer specific) Brochure available on this item, Please view for more information.
CrosScan - (Previously VS2M) Automatic X-Y Scanner 24in. x 24in. (0.61m x 0.61m) scan area Suction feet Liquid feed Battery operated or AC powered 0.020in. (0.5mm) Resolution Works with: Raptor Imaging flaw detector BondHub
Bond Tester Range Brochures Brochures new!